Electronics housing and manufacturing method of electronics housing

ABSTRACT

An electronics housing includes a base body and a metal plating layer formed on a surface of the base body. The base body includes an upper cover, a lower cover and a metal ring. The upper cover and the lower cover are integrally fused by virtue of an ultra high frequency technology, and the metal ring is embedded between the upper cover and the lower cover. A nickel-deposited layer of the metal plating layer is electrolessly deposited on the surface of the base body. A copper layer of the metal plating layer is plated on the nickel-deposited layer. A nano-nickel layer of the metal plating layer is plated on the copper layer. A surface decoration layer of the metal plating layer is plated on the nano-nickel layer. The base body together with the metal plating layer defines at least one assembling hole.

CROSS-REFERENCES TO RELATED APPLICATIONS

This is a division of U.S. patent application Ser. No. 14/864,739, filedSep. 24, 2015, which is incorporated herewith by reference in itsentirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a housing, and moreparticularly to an electronics housing and a manufacturing method ofelectronics housing.

2. The Related Art

Currently, with the development of electronic technologies, a variety ofelectronicses are constantly updated. In general, the electronicses arehandheld products, wearable products, etc. Accordingly, accessoriesapplied to the electronicses are also constantly improved for cateringdevelopment requirements of the electronicses. As is known to all, anelectronics housing is one of the most important accessories of theelectronicses. A current electronics housing includes a base body and aholder. A material of the base body is plastic. The base body is platedto make a metal plating layer formed on a surface of the base body. Theplated base body and the holder are adhered with each other by anadhering technology.

However, the plated base body and the holder are adhered with each otherto form the electronics housing by virtue of the adhering technologythat lowers a waterproof performance, and simultaneously, the materialof the base body is plastic, the metal plating layer is hardly formed onthe surface of the base body, so a surface of the electronics housinghas a worse abrasion performance and a worse corrosion resistanceperformance. As a result, an appearance glossiness of the electronicshousing is affected.

SUMMARY OF THE INVENTION

An object of the present invention is to provide an electronics housingand a manufacturing method of electronics housing. The electronicshousing includes a base body and a metal plating layer. The base bodyincludes an upper cover, a lower cover and a metal ring. The upper coverand the lower cover are integrally fused by virtue of an ultra highfrequency technology, and the metal ring is embedded between the uppercover and the lower cover. The metal plating layer is formed on asurface of the base body. The metal plating layer includes anickel-deposited layer formed on the surface of the base body, a copperlayer formed on a surface of the nickel-deposited layer, a nano-nickellayer formed on a surface of the copper layer, and a surface decorationlayer formed on a surface of the nano-nickel layer.

The manufacturing method of electronics housing adapted for beingapplied in manufacturing the electronics housing is describedhereinafter. The metal ring is disposed between the upper cover and thelower cover. The upper cover and the lower cover are integrally fused byvirtue of an ultra high frequency technology, and the metal ring isembedded between the upper cover and the lower cover. Thenickel-deposited layer of the metal plating layer is electrolesslydeposited on the surface of the base body for metalizing the base body.The copper layer of the metal plating layer is plated on thenickel-deposited layer. The nano-nickel layer of the metal plating layerformed by nano-nickel particles is plated on the copper layer. Thesurface decoration layer of the metal plating layer is plated on thenano-nickel layer. The base body together with the metal plating layerdefines at least one assembling hole by a laser cutting technology.

As described above, the upper cover and the lower cover are integrallyfused by virtue of the ultra high frequency technology to make the uppercover and the lower cover completely sealed for improving a waterproofperformance of the base body, and the metal ring is embedded between theupper cover and the lower cover for improving a current conductioncharacteristic of the base body. Furthermore, the metal plating layerincludes the nano-nickel layer formed by the nano-nickel particles, thenano-nickel particles are capable of making the surface of theelectronics housing more compact to have the better abrasion performanceand the better corrosion resistance performance, so that the nano-nickellayer of the metal plating layer makes the electronics housing look asan integrally molded appearance. As a result, the electronics housinghas a better appearance glossiness.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be apparent to those skilled in the art byreading the following description, with reference to the attacheddrawings, in which:

FIG. 1 is a perspective view of an electronics housing in accordancewith the present invention;

FIG. 2 is a partially exploded view of the electronics housing of FIG.1;

FIG. 3 is a sectional view of the electronics housing of FIG. 1;

FIG. 4 is a schematic diagram showing that the electronics housing inaccordance with the present invention is placed in a plating bath;

FIG. 5 is a schematic diagram showing that a metal plating layer isformed on a surface of a base body of the electronics housing of FIG. 1;and

FIG. 6 is a perspective view of the electronics housing in accordancewith the present invention being applied to an electronic device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

With reference to FIG. 1 and FIG. 5, an electronics housing 100 inaccordance with the present invention is shown. The electronics housing100 includes a base body 10 and a metal plating layer 20 formed on asurface of the base body 10. The metal plating layer 20 includes anickel-deposited layer 21 formed on the surface of the base body 10, acopper layer 22 formed on a surface of the nickel-deposited layer 21, anano-nickel layer 23 formed on a surface of the copper layer 22, and asurface decoration layer 24 formed on a surface of the nano-nickel layer23.

Referring to FIG. 1, FIG. 2 and FIG. 3, a material of the base body 10is acrylonitrile-butadiene-styrene (ABS) plastic which is capable ofbeing plated. The base body 10 includes an upper cover 11, a lower cover12 and a metal ring 13. The metal ring 13 is a closed copper ring. Theupper cover 11 defines a first receiving space 111 penetrating through amiddle of a bottom of the upper cover 11. The lower cover 12 defines asecond receiving space 121 penetrating through a middle of a top of thelower cover 12. The metal ring 13 is mounted around a top periphery ofthe lower cover 12. The upper cover 11 is covered on the lower cover 12.The metal ring 13 is mounted between the upper cover 11 and the lowercover 12. The first receiving space 111 is corresponding to the secondreceiving space 121 to form an accommodating space 14. The upper cover11 and the lower cover 12 are integrally fused by virtue of an ultrahigh frequency technology to make the upper cover 11 and the lower cover12 completely sealed for improving a waterproof performance of the basebody 10. And the metal ring 13 is embedded between the upper cover 11and the lower cover 12 for improving a current conduction characteristicof the base body 10.

Referring to FIG. 6, the electronics housing 100 is applied to anelectronic device 200. The electronic device 200 has at least a button201 and a screen (not labeled). The electronic device 200 is a handheldproduct or a wearable product. The base body 10 together with the metalplating layer 20 defines at least one assembling hole 122 by virtue of alaser cutting technology. Specifically, one side of the lower cover 12together with one side of the metal plating layer 20 opens twoassembling holes 122. The two assembling holes 122 are of differentshapes. Preferably, one of the assembling holes 122 is of a circularshape, and the other assembling hole 122 is of a rectangular shape. Thecircular assembling hole 122 is located in front of the rectangularassembling hole 122. The button 201 is disposed in the assembling hole122. The upper cover 11 defines an opening 112. The screen is assembledto the opening 112.

Referring to FIG. 1 and FIG. 5, the nickel-deposited layer 21 is formedon the surface of the base body 10 by an electroless deposition way formetalizing the base body 10. Specifically, the base body 10 is immersedin an electroless nickel-deposited solution. The electrolessnickel-deposited solution includes a metal salt and a reducing agent.The metal salt is a water soluble hydrochloride, a sulfate or a compoundof the water soluble hydrochloride and the sulfate. Preferably, thewater soluble hydrochloride is a nickel chloride. The sulfate is anickel sulfate. The reducing agent is a hypophosphite, a hydroboron or acompound of the hypophosphite and the hydroboron. Preferably, thehypophosphite is sodium hypophosphite, potassium hypophosphite, or acompound of the sodium hypophosphite and the potassium hypophosphite.The hydroboron is sodium borohydride.

Referring to FIG. 1 and FIG. 5, the copper layer 22 is plated on thesurface of the nickel-deposited layer 21. Specifically, the base body 10together with the nickel-deposited layer 21 is immersed in a copperplating solution to be acted as a first cathode. A copper or otherinsoluble material is acted as a first anode. The copper platingsolution is a solution containing copper ions. After a firstdirect-current power supply is connected, the copper ions are reducedinto the copper layer 22 on the surface of the nickel-deposited layer21.

Referring to FIG. 1, FIG. 4 and FIG. 5, the nano-nickel layer 23 isplated on the surface of the copper layer 22. The nano-nickel layer 23is formed by nano-nickel particles, and each of the nano-nickelparticles has a nanoscale diameter. The nano-nickel particles arecapable of making a surface of the electronics housing 100 more compactto have a better abrasion performance and a better corrosion resistanceperformance. Specifically, put the base body 10 together with thenickel-deposited layer 21 and the copper layer 22 in a plating bath 30to be immersed in a nano-nickel plating solution in the plating bath 30.The base body 10 together with the nickel-deposited layer 21 and thecopper layer 22 is acted as a second cathode, and a pure nickel targetis acted as a second anode. The nano-nickel plating solution is asolution containing nickel ions. A temperature of the nano-nickelplating solution is controlled between 40° C. and 80° C. The pure nickeltarget are transformed into the nickel ions by electrolysis to bedeposited on the surface of the copper layer 22, and the nickel ions areregularly arranged into the layered nano-nickel layer 23 in sequence.The nano-nickel layer 23 of the metal plating layer 20 makes theelectronics housing 100 look as an integrally molded appearance.

Referring to FIG. 1 and FIG. 5, the surface decoration layer 24 isplated on the surface of the nano-nickel layer 23. The surfacedecoration layer 24 is a white chromium layer, a black chromium layer, agold-plated layer, a palladium-plated layer, a nickel-plated layer or aternary alloy layer. The ternary alloy is an alloy of copper, tin andzinc.

Referring to FIG. 1 and FIG. 5, when the white chromium layer is platedon the surface of the nano-nickel layer 23, the base body 10 togetherwith the nano-nickel layer 23 is immersed in a white chromium solutionto be acted as a third cathode, and an insoluble material is acted as athird anode. The white chromium solution is a solution containingchromium ions. After a second direct-current power supply is connected,the chromium ions of the white chromium solution are reduced to a whitechromium layer on the surface of the nano-nickel layer 23.

Referring to FIG. 1 and FIG. 5, when the black chromium layer is platedon the surface of the nano-nickel layer 23, the base body 10 togetherwith the nano-nickel layer 23 is immersed in a black chromium solutionto be acted as a fourth cathode, and an insoluble material is acted as afourth anode. The black chromium solution is a chromic acid—acetic acidsolution, a chromic acid—fluoride solution or a chromicacid—nitrate—boric acid solution. After a third direct-current powersupply is powered on, chromium ions of the black chromium solution arereduced to the black chromium layer on the surface of the nano-nickellayer 23.

Referring to FIG. 1 and FIG. 5, when the gold-plated layer is plated onthe surface of the nano-nickel layer 23, the base body 10 together withthe nano-nickel layer 23 is immersed in a gold solution to be acted as afifth cathode, the insoluble material is acted as a fifth anode. Thegold solution is a solution containing monovelent gold ions. After afourth direct-current power supply is connected, the monovelent goldions are reduced to the gold-plated layer on the surface of thenano-nickel layer 23.

Referring to FIG. 1 and FIG. 5, when the pallatium layer is plated onthe surface of the nano-nickel layer 23, the base body 10 together withthe nano-nickel layer 23 is immersed in a pallatium solution to be actedas a sixth cathode, a titanium-coated ruthenium iridium alloy plate isacted as a sixth anode. The pallatium solution is a solution containingpallatium ions. After a fifth direct-current power is connected, thepallatium ions are reduced to the pallatium layer on the surface of thenano-nickel layer 23.

Referring to FIG. 1 and FIG. 5, when the nickel-plated layer is platedon the surface of the nano-nickel layer 23, after the nano-nickel layer23 is activated by a dilute acid, the base body 10 together with thenano-nickel layer 23 is immersed in a nickel-plated solution to be actedas a seventh cathode, nickel or other insoluble material is acted as aseventh anode. The nickel-plated solution is a solution containingnickel ions. After a sixth direct-current power is powered on, thenickel ions are reduced to the nickel-plated layer on the surface of thenano-nickel layer 23.

Referring to FIG. 1 and FIG. 5, when the ternary alloy layer is platedon the surface of the nano-nickel layer 23, the base body 10 togetherwith the nano-nickel layer 23 is immersed in a ternary alloy solution tobe acted as an eighth cathode, an insoluble material is acted as aneighth anode. The ternary alloy solution is a solution containing copperions, tin ions and zinc ions. After a seventh direct-current power isconnected, the copper ions, the tin ions and the zinc ions are reducedto the ternary alloy layer on the surface of the nano-nickel layer 23.

A hardness of a surface of the metal plating layer 20 is 2H level. Athickness of the metal plating layer 20 is 25 μm.

Referring to FIG. 1 to FIG. 6, a manufacturing method of electronicshousing adapted for being applied in manufacturing the electronicshousing 100, specific steps of the manufacturing method of electronicshousing are described as follows.

The metal ring 13 is disposed between the upper cover 11 and the lowercover 12.

The upper cover 11 and the lower cover 12 are integrally fused by virtueof the ultra high frequency technology, and the metal ring 13 isembedded between the upper cover 11 and the lower cover 12.

The nickel-deposited layer 21 of the metal plating layer 20 iselectrolessly deposited on the surface of the base body 10 formetalizing the base body 10.

The copper layer 22 of the metal plating layer 20 is plated on thesurface of the nickel-deposited layer 21.

The nano-nickel layer 23 of the metal plating layer 20 formed by thenano-nickel particles is plated on the surface of the copper layer 22.

The surface decoration layer 24 of the metal plating layer 20 is platedon the surface of the nano-nickel layer 23.

The base body 10 together with the metal plating layer 20 defines atleast one assembling hole 122 by the laser cutting technology.

Preferably, before the base body 10 is metalized, the manufacturingmethod of electronics housing further includes steps of pre-processingthe surface of the base body 10. The pre-processing steps include an oilremoval step, a coarsening step, a neutralizing step and activationsteps.

The oil removal step is that the surface of the base body 10 is scrubbedby a oil removing liquid for eliminating oil stains and other dirt, thesurface of the base body 10 is ensured to be clean and have no oilstains, so that the surface of the base body 10 is beneficial to beuniformly coarsened. A usage life of a coarsening solution used in thefollowing coarsening step is prolonged.

The coarsening step is to coarsen the surface of the base body 10. Apurpose of coarsening the surface of the base body 10 is to improve ahydrophilcity of the surface of the base body 10 to make the surface ofthe base body 10 form a plurality of micropore shapes for ensuring thesurface of the base body 10 to form a proper roughing degree, so thatthe metal plating layer 20 has a better adhesion force. After oil on thebase body 10 is removed, the base body 10 is immersed in the coarseningliquid to proceed coarsening. The coarsening liquid is a strongcorrosive chromic acid which is formed by a chromic anhydride and asulfuric acid interacting with each other in proper proportions. Acoarsening temperature is 60˜70° C.

An effect of the neutralizing step is to eliminate the coarsening liquidof the surface of the base body 10 for prolonging a usage life of anactivation liquid used subsequently. The neutralizing step is capable ofproceeding by use of various acid liquids. A neutralizing temperature isa room temperature.

The activation steps are to make the coarsened surface of the base body10 be able to adsorb activator colloids uniformly to provide catalyticcarriers for the following electroless nickel-deposited step. Theactivation steps include a preimpregnation step, a colloid palladiumactivating step and a peptizing step. The preimpregnation step and thecolloid palladium activating step are capable of being combined to becompleted.

The preimpregnation step is to immerse the base body 10 in apreimpregnation solution. The preimpregnation solution is capable ofeliminating some impurities for buffering an activation liquid andeffectively preventing a colloid on the surface of the base body 10directly contacting neutral water on the surface of the base body 10from generating a destructive hydrolysis after an acid of the activationliquid is diluted. The preimpregnation solution is a mixed solution of atin salt and a hydrochloric acid. The tin salt is a stannous chloride, astannous mono-sulphate, or a compound of the stannous chloride and thestannous mono-sulphate. A preimpregnation temperature is the roomtemperature.

The colloid palladium activating step is to immerse the preimpregnatedbase body 10 in the activation liquid. The activation liquid is a mixedsolution of a palladium chloride, a hydrochloric acid and the tin salt.A temperature of the activation liquid is 35˜45° C.

A core of the colloid attached to the surface of the base body 10 ispalladium. An outer periphery of the colloid is particle clusters ofdivalent tin. In wash, the divalent tin is easily hydrolyzed to acolloidal shape to wrap the palladium, so a catalytic action of thepalladium has no way of reflecting. A purpose of the dispergation is toeliminate the divalent tin left on the surface of the base body 10 toexpose the palladium and make the palladium become a catalytic activitypoint of the electroless nickel deposition. A dispergation solution isgenerally a hydrochloric acid solution. A temperature of the peptizationis 35˜45° C.

Preferably, a washing step is included for eliminating the solution lefton the surface of the base body 10. Water used in the washing step is adeionized water, a distilled water, a purified water or a compound ofthe deionized water, the distilled water and the purified water.

Preferably, before the upper cover 11 and the lower cover 12 are fusedto the integrity, the electronic device 200 defines a window 112.

As described above, the upper cover 11 and the lower cover 12 areintegrally fused by virtue of the ultra high frequency technology tomake the upper cover 11 and the lower cover 12 completely sealed forimproving the waterproof performance of the base body 10, and the metalring 13 is embedded between the upper cover 11 and the lower cover 12for improving the current conduction characteristic of the base body 10.Furthermore, the metal plating layer 20 includes the nano-nickel layer23 formed by the nano-nickel particles, the nano-nickel particles arecapable of making the surface of the electronics housing 100 morecompact to have the better abrasion performance and the better corrosionresistance performance, so that the nano-nickel layer 23 of the metalplating layer 20 makes the electronics housing 100 look as theintegrally molded appearance. As a result, the electronics housing 100has a better appearance glossiness.

What is claimed is:
 1. A manufacturing method of electronics housingadapted for being applied in manufacturing an electronics housing, theelectronics housing including a base body and a metal plating layerformed on a surface of the base body, the base body including an uppercover, a lower cover and a metal ring, the manufacturing method ofelectronics housing comprising the steps of: the metal ring beingdisposed between the upper cover and the lower cover; the upper coverand the lower cover being integrally fused by virtue of an ultra highfrequency technology, and the metal ring being embedded between theupper cover and the lower cover; a nickel-deposited layer of the metalplating layer being electrolessly deposited on the surface of the basebody for metalizing the base body; a copper layer of the metal platinglayer being plated on a surface of the nickel-deposited layer; anano-nickel layer of the metal plating layer formed by nano-nickelparticles being plated on a surface of the copper layer; a surfacedecoration layer of the metal plating layer being plated on a surface ofthe nano-nickel layer; and the base body together with the metal platinglayer defining at least one assembling hole by a laser cuttingtechnology.
 2. The manufacturing method of electronics housing asclaimed in claim 1, wherein each of the nano-nickel particles has ananoscale diameter.
 3. The manufacturing method of electronics housingas claimed in claim 1, wherein the surface decoration layer is plated onthe surface of the nano-nickel layer, the surface decoration layer is awhite chromium layer, a black chromium layer, a gold-plated layer, apalladium-plated layer, a nickel-plated layer or a ternary alloy layer,the ternary alloy is an alloy of copper, tin and zinc.
 4. Themanufacturing method of electronics housing as claimed in claim 1,wherein a material of the base body is acrylonitrile-butadiene-styreneplastic which is capable of being plated.
 5. The manufacturing method ofelectronics housing as claimed in claim 1, wherein the metal ring is aclosed copper ring.
 6. The manufacturing method of electronics housingas claimed in claim 1, wherein a hardness of a surface of the metalplating layer is 2H level.
 7. The manufacturing method of electronicshousing as claimed in claim 1, wherein a thickness of the metal platinglayer is 25 μm.
 8. The manufacturing method of electronics housing asclaimed in claim 1, wherein the upper cover defines a first receivingspace penetrating through a middle of a bottom of the upper cover, thelower cover defines a second receiving space penetrating through amiddle of a top of the lower cover, the upper cover is covered on thelower cover, the first receiving space is corresponding to the secondreceiving space to form an accommodating space.
 9. The manufacturingmethod of electronics housing as claimed in claim 1, wherein theelectronics housing is applied to an electronic device, the electronicdevice has at least a button, the base body together with the metalplating layer defines at least one assembling hole, the button isdisposed in the assembling hole.